| 摘要 |
<p>A module containing electronic components (6) for use in fast computers, where much is dissipated from the components (6) therein,is self-supplied with its own primary cooling system. The module is constituted by a 'hermetically' closed container filled with an inert liquid with a low boiling point. The module consists substantially of a bottom part (1) and a top part (2). The heat from the electronic components (6) is transferred from the components to the internal top surface (11) of the module via the phase transition of the liquid (i.e. boiling), its natural convection and the new phase transition (i.e. condensation at the inner surface (11)). The module is fastened with an external surface (8) in direct thermal contact with a corresponding surface of a secondary cooling system. The module is constructed to withstand the internal pressure which arises in the cavity (10).</p> |
