RESIN SEALING EQUIPMENT FOR ELECTRONIC PARTS,申请号JP19890253105-传众专利搜索

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发明名称	RESIN SEALING EQUIPMENT FOR ELECTRONIC PARTS
摘要
申请公布号	JPH03114237(A)	申请公布日期	1991.05.15
申请号	JP19890253105	申请日期	1989.09.28
申请人	MITSUBISHI ELECTRIC CORP	发明人	TAKESUE KIYOSHI;MATSUO MITSUTAKA;IRIGUCHI NOBUTAKA;KAI YASUYOSHI;MATSUO ITARU
分类号	H01L21/56;H01L21/48	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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