发明名称 RESIN COMPOSITION AND MULTILAYERED STRUCTURE
摘要 <p>Provided are resin compositions comprising: (A) 60 to 95% by weight of an ethylene-vinyl acetate copolymer having an ethylene content of 20 to 65 mol% and a saponification degree of the vinyl acetate component of at least 96%, (B) 4.5 to 39.5% by weight of an ethylene-vinyl acetate copolymer having an ethylene content of 60 to 98 mol%, and (C) at least 0.5% by weight of a saponified product of an ethylene-vinyl acetate copolymer having an ethylene content of 68 to 98 mol% and a saponification degree of the vinyl acetate component of at least 20%, the incorporation ratio of (C) based on the sum of (B) and (C) being not more than 38% by weight. The resin compositions of the present invention have markedly improved flexibility without deteriorating transparency and gas barrier properties as compared with conventional saponified products of ethylene-vinyl acetate copolymers. Multilayered structures comprising at least one layer of the composition have excellent resistance to falling shock, flexural resistance, prevention of air-back, skin-pack adaptability and shrink-packaging capability and are hence of great value for packaging various goods.</p>
申请公布号 EP0425820(A3) 申请公布日期 1991.05.15
申请号 EP19900118674 申请日期 1990.09.28
申请人 KURARAY CO., LTD. 发明人 ITAMURA, SUMIO;MORITANI, TOHEI
分类号 B32B27/28;B32B27/08;C08L23/08;C08L23/26;C08L29/04;(IPC1-7):C08L29/04;B32B27/32 主分类号 B32B27/28
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