| 摘要 |
PURPOSE: To distribute photo-resist liquid on the surface of a semiconductor wafer more evenly, by moving wafer's rotation axis to a wafer while the wafer is rotating in the process where the photo-resist liquid is applied on the surface of the semiconductor wafer. CONSTITUTION: Manufacturing of an integrated circuit comprises, a process where a photo-resist liquid is applied on the surface of a semiconductor wafer 11, and then the wafer 11 is rotated so that the photo-resist liquid is applied on the surface of the semiconductor wafer 11, a process where a photo-resist is selectively exposed, a process where a photo-resist film is developed, and a process where the developed photo-resist film is used for demarcating a pattern on the surface of the wafer 11. The apply process includes a step where, so that the photo-resist liquid is more evenly distributed, the rotation axis of the wafer 11 is, while during its rotation, moved to the wafer 11. for example, the wafer 11 is set on a rotation member 18 through a piston 13, magnet 18, etc., and during the rotation of the member 18, the wafer 18 is moved against the member 18.
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