| 摘要 |
<p>A molding polyamide resin composition comprising (A) 50 to 99 parts by weight of a polyamide resin derived from xylylenediamine as a main diamine component and an alpha,omega-straight chain aliphatic dicarboxylic acid as a main dicarboxylic acid component, (B) 1 to 50 parts by weight of polyhexamethyleneadipamide resin, (C) 5 to 85 parts by weight, per 100 parts by weight of components (A) and (B) combined, of a thermosetting resin powder having an average particle diameter of 1 to 800 micrometers, and (D) 5 to 200 parts by weight, per 100 parts by weight of components (A) and (B) combined, of glass fibers, the total amount of the polyamide resin components (A) and (B) being 100 parts by weight.</p> |
