| 摘要 |
A semiconductor chip carrier which allows connections to points within the area of the carried chip or chips (9) instead of, or as well as, to points along the edges of the chips. The carrier comprises a frame defining a generally planar compartment for the chips and having an edge portion (13) extending around the edge of the compartment and at least one bridge portion (15) extending across the compartment between spaced locations on the edge portion. The bridge portion carries electrical conductors (19) for effecting connection between the chip and terminals (17) carried by the frame. <IMAGE> |
