| 发明名称 |
Method and apparatus for bonding component leads to pads located on a non-rigid substrate. |
| 摘要 |
<p>Component leads (16) are bonded to pads (14) disposed on a non-rigid substrate (10) by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare-copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably an epoxy printed circuit board.</p> |
| 申请公布号 |
EP0423433(A1) |
申请公布日期 |
1991.04.24 |
| 申请号 |
EP19900113636 |
申请日期 |
1990.07.17 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHALCO, PEDRO A. |
| 分类号 |
H01L21/607;B23K1/005;B23K20/10;B23K20/12;B23K26/06;H01L21/60;H05K3/32 |
主分类号 |
H01L21/607 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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