| 摘要 |
<p>Disclosed are curable compositions based on a combination of polyphenylene ether, an upstaged epoxy resin combination, a multifunctional epoxy resin, and suitable curing agents. The upstaged epoxy resin combination comprises a low molecular weight brominated upstaged epoxy resin and a monomeric brominated epoxy resin. The composition may be used in the preparation of laminates useful as printed circuit boards.</p> |
