摘要 |
<p>This invention provides a lead alloy foil comprising 0 to 4 wt % of tin, 0.5 to 7.0 wt % of antimony, and the balance being lead, wherein Sn/Sb ratio is 3 or less. It also provides a lead laminated tape for covering cables, comprising a lead alloy foil comprising 0 to 4 wt % of tin, 0.5 to 7.0 wt % of antimony, and the balance being lead, wherein Sn/Sb ratio is 3 or less, and an electrically conductive plastic film laminated at least one of the surfaces of the lead alloy foil and having a volume resistivity of 106 OMEGA -cm or less.</p> |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP |
发明人 |
UEMATSU, TADAYUKI, CHIBA-SHI CHIBA-KEN, JP;FUKUDA, TERUO;TODA, TOMOHIRO, ICHIHARA-SHI CHIBA-KEN, JP;MORI, ATSUSHI, OOSAKA-SHI OOSAKA, JP;TAMURA, YOSHITAKA, TAKATSUKI-SHI OOSAKA, JP;KASAHARA, KEIZO, MORIYAMA-SHI SHIGA-KEN, JP |