| 摘要 |
A cooling system for a three-dimensional IC package in which a plurality of substrates each mounting ICs on its one or both surfaces are laminated with a predetermined interval therebetween, includes a cold plate in which holes are formed at positions corresponding to the ICs and a cooling fluid path are formed around the holes, a heat conductive piston, inserted in each hole of the cold plate while keeping a small gap with respect to the inner wall of the hole, and biased by a spring to be moved in the hole, for conducting, when one end thereof is brought into contact with a heat radiating surface of the IC, the heat to the cold plate, and a device for interrupting a contact between the heat conductive piston and the IC so that the substrate can be easily inserted/removed. |
