| 摘要 |
<p>PURPOSE:To prevent the circuit breakdown by static electricity by automatically exfoliating and removing a protective sheet through an exfoliating mechanism, under bonding through an adhesive layer by a long conductive tearing tape consisting of flexible base material, and under earth processing through the tearing tape. CONSTITUTION:A tearing tape 3 is bonded with the rear 11 of a protective sheet 1. The bonding is done through an adhesive layer 33, and the bonding force of the adhesive layer 33 to the protective sheet 1 is set so that it may be higher than the bonding force of the protective sheet 1 to the circuit pattern formation face of a semiconductor wafer. The peeling method is the one of automatically peeling the protective sheet 1 through the tearing tape 3 and an exfoliating mechanism under the adhesion of the tearing tape 3 to the protective sheet 1 stuck to the circuit pattern formation face of the semiconductor wafer 4, and besides the processing is done under the earth processing 5 through the tearing tape 3. For example, in the condition that the semiconductor wafer 4 is fixed onto a fixing table 6 by sucking method, etc., the tearing tape 3 is shifted through a guide roll 7, whereby the protective sheet 1 on the semiconductor wafer 4 is peeled and removed automatically.</p> |
