发明名称 Microwave cathode sputtering arrangement
摘要 The invention relates to a microwave cathode sputtering arrangement in which a cathode is disposed opposite a substrate. In the immediate vicinity of the substrate is located at least one magnetic field whose strength leads to an electron cyclotron resonance.
申请公布号 US5006219(A) 申请公布日期 1991.04.09
申请号 US19890413863 申请日期 1989.09.28
申请人 LEYBOLD AKTIENGESELLSCHAFT 发明人 LATZ, RUDOLF;SCHERER, MICHAEL;GEISLER, MICHAEL;JUNG, MICHAEL
分类号 H01J37/32;H01J37/34 主分类号 H01J37/32
代理机构 代理人
主权项
地址
您可能感兴趣的专利