发明名称 |
ALTERATION OF AT LEAST ONE FACET OF POLYIMIDE BASE |
摘要 |
<p>The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 mu m in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.</p> |
申请公布号 |
JPH0382750(A) |
申请公布日期 |
1991.04.08 |
申请号 |
JP19900182538 |
申请日期 |
1990.07.10 |
申请人 |
MINNESOTA MINING & MFG CO <3M> |
发明人 |
NANAYATSUKARA RIYANAGE DON SOMASHIRI;TOOMASU AASAA SUPETSUKUHAADO |
分类号 |
B32B15/088;C23C14/20;C23C18/20;C23C18/22;C23C18/40;C23C28/02;C25D5/10;H05K3/38 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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