发明名称 SPUTTERING APPARATUS AND SPUTTERING PROCESSING SYSTEM USING THE SAME
摘要 <p>An apparatus used for manufacturing optical disks, for example. A vacuum chamber for sputtering process has an opening and a sputtering section. An object, such as a disk substrate, is loaded through the opening and placed in the sputtering process section. A rotatable arm is disposed in the vacuum chamber so as to transfer the object from the opening to the sputtering section. By this construction, the structure of the chamber is simple, the size is small, and the number of objects processed per unit time is increased. At least two apparatuses may be installed so that during the time after the end of one sputtering process till the start of the next process in one apparatus, a sputtering process can be performed in another apparatus. By the contrivance, instead of provision of devices such as power supplies in each apparatus, only one set of devices can be commonly provided for all the apparatuses. Thus, the configuration and productivity are further improved.</p>
申请公布号 WO1991004352(P1) 申请公布日期 1991.04.04
申请号 JP1990001170 申请日期 1990.09.12
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