发明名称 Process for forming deposited film and process for producing semiconductor device.
摘要 <p>A process for forming a deposited film comprises the steps of; (a) disposing in a space for forming a deposited film a substrate having an electron donative surface; (b) introducing to the space for forming a deposited film i) a gas comprising an organic metal compound containing a tungsten atom and ii) a hydrogen gas; and (c) forming a tungsten film on the electron donative surface. </p>
申请公布号 EP0420590(A2) 申请公布日期 1991.04.03
申请号 EP19900310501 申请日期 1990.09.25
申请人 CANON KABUSHIKI KAISHA 发明人 MATSUMOTO, SHIGEYUKI, C/O CANON KABUSHIKI KAISHA;IKEDA, OSAMU, C/O CANON KABUSHIKI KAISHA;OHMI, KAZUAKI, C/O CANON KABUSHIKI KAISHA
分类号 H01L21/285;H01L21/768 主分类号 H01L21/285
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