PROCESS FOR THE MANUFACTURE OF A TITANIUM/TITANIUM NITRIDE DOUBLE LAYER FOR USE AS A CONTACT AND BARRIER LAYER IN VERY LARGE SCALE INTEGRATED CIRCUITS,申请号EP19880101643-传众专利搜索

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发明名称	PROCESS FOR THE MANUFACTURE OF A TITANIUM/TITANIUM NITRIDE DOUBLE LAYER FOR USE AS A CONTACT AND BARRIER LAYER IN VERY LARGE SCALE INTEGRATED CIRCUITS
摘要
申请公布号	EP0280089(B1)	申请公布日期	1991.04.03
申请号	EP19880101643	申请日期	1988.02.04
申请人	SIEMENS AKTIENGESELLSCHAFT	发明人	KOHLHASE, ARMIN, DR.;HIGELIN, GERALD, DR.
分类号	C23C14/06;C23C14/34;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;H01L21/28	主分类号	C23C14/06
代理机构		代理人
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