Method for the fabrication of a heat transfer member for electronic systems

摘要

A method for the fabrication of a heat transfer member for use with electronic or microwave systems is described. The thermal heat transfer member is a generally planar composite member in which elongated high thermal conductivity fibers are disposed within a matrix material. The method involves molding epoxy matrix material along with conductive graphite fibers and filler material in predetermined geometries. The molded member is then formed in a manner such that the fiber ends are cleanly exposed at the surface of the member in predetermined locations. Metal caps may be formed over the fiber ends to improve heat transfer. Heat is transferred into the member, along the commonly directed fibers, then out of the member at a heat output surface.