| 摘要 |
<p>PURPOSE:To make electronic components of different heights uniform in height so as to enable them to be mounted by a method wherein an electronic component is mounted on a substrate as brazed to a recess provided to the substrate through a conductive pin, and the mounting height is controlled by adjusting the depth of the recess and the length of he conductor pin. CONSTITUTION:A chip 2 of GaAs and a chip 3 of Si which are different from each other in thermal expansion coefficient are mounted on a board 1. The board 1 is formed of glass ceramic whose thermal expansion coefficient is close to that of the chip 2, a recess is provided to the chip 3 mounting part of the board 1, and the chip 3 is connected with solder 7 to the heads of conductor pins 5 planted in the base of the recess. The chip 3 is made level with the chip 2 by adjusting the depth of the recess 4 and the length of the conductor pins 5. By this setup, a cooling structure 8 can be formed into an integral structure for the chips 2 and 3.</p> |
