| 摘要 |
<p>PURPOSE:To obtain III-V semiconductor pellet having narrow cuff width even in dicing with blade dicing method and capable of preventing chipping by specifying the surface of pellet and side face of pellet orthogonal to said surface. CONSTITUTION:The aimed III-V semiconductor pellet has the surface of pellet selected from one of (100) plane and side face selected from one of (100) plane orthogonal to said selected surface. In said pellet, effect of the strongest (111) plane is not affected in dicing and cuff width becomes narrower and also chipping amount is reduced, as the surface of pellet is selected from one of (100) plane and side face of pellet is selected from one of (100) plane orthogonal to said selected (100) plane.</p> |
