| 摘要 |
PURPOSE:To prevent an erroneous operation of an internal circuit due to incident light from a side face by die bonding a semiconductor chip to a recess formed on a die pad. CONSTITUTION:A recess which is slightly larger than a semiconductor chip 1 is formed on a die bonded part of a die pad 3 to the chip 1, the chip 1 is die bonded to the recess, and the side and rear faces of the chip 1 are surrounded by the recess. A bonding pad on the chip 1 is wire bonded to an outer lead frame 4 provided in the same height as the pad via an Au wiring 6, and wholly enclosed with a transparent molding resin 5. Thus, unnecessary incident light can be prevented to prevent an erroneous operation of an internal circuit generated by the incident light.
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