发明名称 Precision buttable subunits via dicing
摘要 A buttable edge surface in a substrate is fabricated by sawing a back cut in a base surface of the substrate and then cutting a section cut through the upper surface of the back cut to intersect the back cut. The location of the section cut defines the buttable edge surface of the substrate. The section cut divides the substrate into a plurality of subunits which can be butted together to form an elongated array of butted subunits. The cutting blade preferably is a resinoid blade.
申请公布号 US5000811(A) 申请公布日期 1991.03.19
申请号 US19890440216 申请日期 1989.11.22
申请人 XEROX CORPORATION 发明人 CAMPANELLI, MICHAEL R.
分类号 B41J2/16;B41J2/145;H01L21/304;H01L29/06 主分类号 B41J2/16
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