Method of fabricating interconnections to I/O leads on layered electronic assemblies

摘要

Interconnect circuitry is formed on a selected face of several separate layered electronic assemblies simultaneously. This circuitry interconnects the I/O leads on each assembly, and it is formed by the steps of: (a) placing a plurality of the assemblies in a fixture with spacers between each assembly; (b) aligning to a single plane, one face of each assembly in the fixture on which the circuitry is to be formed; (c) mechanically squeezing the assemblies and spacers together with the fixture such that the aligned faces are held in the single plane and are exposed; (d) depositing and patterning layers of insulative and conductive materials on all of the exposed faces in the fixture; and (e) severing the layers between the faces in the space provided by the spacers. With this process, beading effects in materials that are spun onto the assemblies are eliminated; handling damage to the assemblies is eliminated; and the time and expense of processing one assembly separately is cut by several hundred percent.