| 摘要 |
<p>PURPOSE: To obtain a method for bonding a conductor to a contact of an integrated circuit and to a support member in which a ribbon can be soldered while selecting the material, the size and the bonding position there freely by separating the integrated circuit and the conductor to be bonded from the conductor supporting member thereby separating the conductor to be bonded. CONSTITUTION: A support, member 20 defining a window 21 is shown. The support member 20 is made of plastic or metal and conductive ribbons 22, 23 being set with Au, Al, Cu, etc., is bonded to the support member 20. A silicon chip 24 having contacts 25, 26 is aligned at a bonding position on the support member and the ribbons are fixed continuously using a ribbon 22 being bonded at first to the support member 20. The ribbon is torn at a supplying position and then the support member is bonded to a pad 26 for forming the ribbon 23.</p> |
