| 摘要 |
<p>The invention concerns a method and an apparatus for feeding a substrate (3) stepwise and peeling an attached cover tape (8) therefrom in order to uncover components carried by said substrate for pick-up of said components by passing said cover tape around a guide surface of a peeler arm (62) and redirecting said cover tape in a direction generally reverse to a direction of said substrate feeding thanks to passing and redirecting means and applying tension to said cover tape in said reverse direction thanks to tension applying means (74, 75). With a view to minimize the peeling tension, relief the tension on the cover material during feeding of the supply tape and avoiding the breakage of the cover tape, according to the invention, said guide surface is retracted in said reverse direction during said pelling thanks to retracting means (8, 74, 75), and contact is maintained between said tape cover (8) and said guide surface (68) during said retracting thanks to maintaining means (96).</p> |
