| 发明名称 |
BOND PARAMATERS CONTROL DURING BONDING |
| 摘要 |
<p>A method of monitoring bonding parameters during a bonding process. The method is based on the object of continuous monitoring of bonding parameters in order to provide adjustment of bonding machines and thereby increase the reliability of the bonded connections. A bonding force is measured by a wire strain gauge attached to a bonding arm and an ultrasound amplitude is measured by a piezo-electric sensor secured to the bonding arm. The method can be used with all bonding machines which work with ultrasound.</p> |
| 申请公布号 |
EP0275877(A3) |
申请公布日期 |
1991.03.06 |
| 申请号 |
EP19880100121 |
申请日期 |
1988.01.07 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT BERLIN UND MUNCHEN |
发明人 |
V. RABEN, KLAUS-ULRICH, PH. D. |
| 分类号 |
B23K20/00;B23K20/10;B29C65/00;B29C65/08;G01H1/16;H01L21/60;H01L21/607;(IPC1-7):H01L21/607 |
主分类号 |
B23K20/00 |
| 代理机构 |
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代理人 |
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