发明名称 POLISHING DEVICE
摘要 PURPOSE:To constantly maintain the lower surface of a work piece in a stable condition wherein it follows the upper surface of a flat lapping machine under a fixed load by sticking a work piece to the lower surface of a supporting plate, and loosely fitting the supporting plate and a weight of fixed heaviness into the tubular portion of a jig placed on a flat lapping machine, while putting the supporting plate on the weight. CONSTITUTION:The lower surface of a work piece 3 is constantly exerted with the load of a weight 5 and a supporting plate 4 to which the load of the work piece 3 itself is added. In this case, the weight 5 and the supporting plate 4 make contact with each other at the edged portion of a projecting portion 5a and at one point of a recessed portion 4a so the lower surface of the work piece 3 constantly and naturally follows the surface of a flat lapping machine 1. Under this condition the flat lapping machine 1 is rotated at high speed, and then the surface of the flat lapping machine 1 and the lower surface of the work piece 3 rub against each other and the work piece 3 is polished under a stable condition wherein the lower surface of the work piece 3 naturally follows the surface of the flat lapping machine 1 under a fixed load exerted by the weight 5.
申请公布号 JPH0343151(A) 申请公布日期 1991.02.25
申请号 JP19890176219 申请日期 1989.07.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 MISHIMA HIDETAKE
分类号 B24B37/27;B24B37/28 主分类号 B24B37/27
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