| 摘要 |
An object of the invention is a device for interconnection between an integrated circuit and an electrical circuit, such as a printed circuit. This device has, depending on the desired interconnection, an insulating platelet or several, stacked insulating platelets. Each of the platelets is crossed by a pre-determined number of electricity conducting channels without offset and by a pre-determined, non-zero number of electricity conducting channels with an offset in the plane of the platelet and in a direction that is prefixed and proper to the platelet. Selected conduction routes are established by burning out the non-selected channels. The device is placed between the active face of the integrated circuit and the electrical circuit. The choice of the number of platelets of the device, of their respective orientations, and of the number of channels with and without offset within each platelet, enables any correspondence whatsoever to be achieved between the contact zones of the integrated circuit and the connection points of the electrical circuit. Another object of the invention is a method for the fabrication of a platelet of this device.
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