发明名称 |
Ceramic-glass integrated circuit package with ground plane |
摘要 |
A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve as a ground plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground plane but physically separated therefrom. Incorporation of a ground plane into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
|
申请公布号 |
US4992628(A) |
申请公布日期 |
1991.02.12 |
申请号 |
US19900519796 |
申请日期 |
1990.05.07 |
申请人 |
KYOCERA AMERICA, INC. |
发明人 |
BEPPU, HENRY;KUSHUHARA, TOSHI;NOMURA, AKI |
分类号 |
H01L23/057;H01L23/10 |
主分类号 |
H01L23/057 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|