| 摘要 |
PURPOSE:To enable a chip to be transferred from a chip feed section to a board and mounted on it at a high speed by a method wherein a light source is made to protrude under a chip held by a nozzle while a transfer head is in motion and irradiate the chip from the lower side, and the chip is observed through a vacuum unit by a camera provided above the vacuum unit. CONSTITUTION:A transfer head 10 is moved above a chip feed section 7, a nozzle 17 is made to descend to hold a chip P by suction from the chip feed section, to take up the chip P, and to ascend. The nozzle 17 starts to move toward a board 8 as ascending, a cylinder 41 is operated to make a light source 40 advance under the chip P and turned ON, and the chip P held by the nozzle 17 is observed by a camera 18. A computer computes the positional deviations of the chip P in the directions of X, Y, and theta from the observation result by the camera 18, the nozzle 17 is made to descend, and the chip P is mounted on the board 8. |
