| 摘要 |
<p>PURPOSE:To remove dust particles produced wafer a water and a wafer-holding tool are rubbed or to remove reaction products between a treatment liquid and the wafer or the wafer-holding tool by installing a discharge port connected to a flow path and another flow path which are connected to individual holding grooves. CONSTITUTION:In a wafer-holding tool 11 which is provided with holding grooves 12 used to separate and hold individual wafers 15 by holding both side-end parts of the wafers 15, the following are provided: flow paths 14a connected to the holding grooves 12; discharge ports 13a connected to the flow paths 14a. As a result, when, e.g. the discharge ports 13a are connected to a pump for suction use or the like, dust particles, reaction products or the like can be sucked from the holding grooves 12 together with a treatment liquid and can flow out to the outside of a treatment tank via the flow paths 14a/the discharge ports 13a even when they are produced. Thereby, the dust particles which have been produced when the wafers 15 and the wafer-holding tool 11 are rubbed and which have adhered to the surface of the wafers can be re moved without being dispersed into the treatment liquid or a treatment gas, or the reaction products between the treatment liquid and the wafers 15 or the wafer-holding tool 11 can be removed without being dispersed into the treatment liquid.</p> |
