发明名称 INTEGRATED CIRCUIT LEAD ASSEMBLY STRUCTURE
摘要 PURPOSE: To minimize the signal reflection and equalize signal propagation delays by crossing adjacent signal leads at certain points along the length of the leads to make the coupling between adjacent lines and cross talk controllable. CONSTITUTION: On the upper and lower sides of a PC board 10, lead patterns 40, 50 are formed, respectively. The pattern 40 is shaped so that all leads extend to two end edges of the board upper side while the pattern 50 is so that all the leads extend to other two end edges on the board 10, resulting in that all the leads of the pattern 40 cross one or more leads of the pattern 50 at angle of 90 deg. and all the leads of the pattern 50 cross at least one lead of the pattern 40. Thus the coupling between adjacent leads is reduced.
申请公布号 JPH0327564(A) 申请公布日期 1991.02.05
申请号 JP19900132412 申请日期 1990.05.21
申请人 ADVANCED MICRO DEVICDS INC 发明人 ARUBAATO TSUAN CHIEN MUU
分类号 H01L23/50;H01L23/12;H01L23/498;H01L23/64 主分类号 H01L23/50
代理机构 代理人
主权项
地址