| 摘要 |
PURPOSE:To improve the work efficiency of a bonding work for bringing a photodetector unit and a connecting terminal to wiring and to miniaturize the optical pickup head device by placing the surface of the photodetector unit and the upper part of the connecting terminal in a package roughly on the same plane. CONSTITUTION:This device is provided with a semiconductor laser 1 for emitting a coherent beam, a photodetector unit 5, a block 3 for radiating heat generated from the light source 1, and a package 2 containing the light source 1 and the photodetector unit 5, and a hybrid device is constituted of the light source 1, the photodetector unit 5 and the package 2. In such a case, by placing the photodetector unit 5 in the bottom part of the package 2, the photodetector unit 5 and the upper part of a connecting terminal 101 can be placed on the same plane in a state that height of the connecting terminal 101 in the package 2 is held low, and a bonding wire can be held shortly and stably. In such a way, the device can be miniaturized. |
