SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF, AND LEAD FRAME

摘要

PURPOSE:To make the intervals of leads nearly half so as to make a hybrid integrated circuit device small in size and high in density by a method wherein a part of the leads is connected to the surface of a wiring board, and the rest is connected to the rear side of the wiring board. CONSTITUTION:Leads 2 are alternately connected to the front and the rear side of a board 1 along a direction of lead arrangement. As the outer parts of two lead rows are formed into one row or made level with each other, the leads 2 are bend once near the board 1 toward the rear or the front side of the board 1 respectively so as to make their outer parts level with each other. The tips 17 of the leads 2 alternately arranged on the front side of the board 1 are fixed to solder pads 5 formed on the front side of the board 1. The tips 18 of the leads 2 alternately arranged on the rear side of the board 1 corresponding to the spaces between the tips 17 on the front side are fixed to the solder pads 5 formed on the rear side. The lead intervals of the tips 17 and 18 are made equal to f and twice as large as the lead pit p of the leads 2. By this setup, the lead intervals can be lessened to an irreducible minimum that the connecting parts of adjacent leads are prevented from being connected together by solder.