发明名称 EPOXY RESIN COPPER COATED LAMINATED BOARD
摘要 PURPOSE:To improve adhesion strength of epoxy resin and a copper foil by using epoxy resin having three or more epoxy radicals in one molecule and by attaching a silane coupling agent to a rough side of the copper foil. CONSTITUTION:A copper foil whose lustrous surface is masked is immersed in acetic aqueous solution such as beta-(3,4-epoxycyclohexyl)ethyl trimethoxy silane to attach silane coupling agent to a rough side of the copper foil. A mixture of epoxy resin which includes epoxy resin having three or more epoxy radicals in one molecular at least 10wt.% and a prepreg are laminated between two sheets of copper foil. The lamination is heated, pressurized and cured. Accordingly, it is possible to improve adhesion of epoxy resin and a copper foil and to improve reliability of a fine pattern such as a high density printed substrate.
申请公布号 JPH02308592(A) 申请公布日期 1990.12.21
申请号 JP19890129810 申请日期 1989.05.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUTAKUCHI MICHIO;OKABASHI KAZUO;NAKAJIMA HIROYUKI;TAKAHAMA TAKASHI
分类号 B32B15/08;B32B15/092;H05K1/03;H05K3/38 主分类号 B32B15/08
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