| 摘要 |
<p>PURPOSE:To increase the yield of the title thick film element by a method wherein the element is provided with a ceramic insulating substrate, electrode layers, and resistor layers formed to stride and electrically connect the electrode layers by thick film printing. CONSTITUTION:The electrode layers 2a, 2b to be formed on the specific surfaces on a ceramic insulating substrate 1 are printed to be kept in the thickness not exceeding 5mum and then the substrate 1 is heat-treated to form the required electrode layers 2a, 2b by baking. Later, resistor layers 3 are formed to stride the paired electrode layers 2a, 2b with a paste for resistor by thick film printing, and then baking the paste. Through these procedures, the title thick film element provided with the smooth resistor layers 3 arranged to overlap by 0.1mm with the mutually opposing sides of the 4mum thick electrode layers 2a, 2b formed at the interelectrode distance of 0.5mm on the specific surfaces of the substrate 1 as well as with the resistance value precision not exceeding + or -20% without any trimming process and the yield exceeding 95% can be manufactured.</p> |
