| 摘要 |
The invention relates to the housings for encapsulating integrated circuits. In order to benefit from the low cost of manufacture of moulded plastic housings whilst improving their performance, the invention proposes to prepare a moulded housing 10 with a cavity 12 and two staggered, overlaid connecting grids 21, 23, 21', 23', the moulding being carried out before positioning the chip. The chip is then placed into the cavity, leads are soldered between the chip and the ends of the two grids. The density of usable interconnection pins is increased by virtue of the two grid levels; resistance to the penetration of moisture is enhanced since a plastic with high shrinkage coefficient can be used without any risk of damaging the chip; indeed, the chip is no longer embedded in plastic; it remains in the open, protected by a cover 16 for closing the housing. <IMAGE> |
