| 摘要 |
<p>PURPOSE:To improve the packaging density of a semiconductor device by connecting the lead of other semiconductor device to the surface of a semiconductor device forming a resin package, and handling the surface of the semiconductor device as a mounting substrate. CONSTITUTION:Other semiconductor device 6 is placed on a semiconductor device 10 where top and side wirings 3 and 5 and foot prints 4 and the surface are formed, and then the foot prints 4 of the semiconductor device 10 and the leads 7 of the other semiconductor device 6 are connected electrically with each other by conductive material such as solder, etc. By providing top and side wirings 3 and 5 and foot prints and the surface of the semiconductor device 10, the surface of the semiconductor device 10 becomes the same conditions as the mounting substrate, and the other semiconductor substrate 6 can be mounted there. Furthermore, by providing wirings and foot prints at the surfaces of other semiconductor devices 6 as well, the semiconductor devices can be mounted in many stages.</p> |
