| 摘要 |
PURPOSE:To elevate heat radiation property, and to prevent malfunction of an IC chip, characteristic decline, and breakdown by attaching, by bonding, a metallic piece to the surface of synthetic resin after resin sealing. CONSTITUTION:An IC chip 11 is mounted on a die pad 12, and is connected with a lead 15 by a wire 14, and is sealed with synthetic resin 10. After this semiconductor device is soldered to a printed board, a metallic piece 20 is attached by adhesives 21. And the heat generated in the IC chip 11 is transmitted from the synthetic resin 10 to the metallic piece 20 directly, and by the high heat-conductivity the heat radiation property of the semiconductor device increases. |
