| 摘要 |
<p>PURPOSE:To ease dust-proof measures and reduce adhesion of particles to a wafer and a carrier by placing a wafer array pitch conversion mechanism at the lower part of first and second carrier positions. CONSTITUTION:It is possible to convert array pitch of wafers and to move a plurality of wafers simultaneously between two types of carriers 11 and 12 with different array pitch of a wafer 1 by a moving element with a wafer- housing groove 2 which can move smoothly on a guide axis 4, a stopper 5 limiting the amount of move provided at each moving element 3, and a driving means 10 for moving each moving element. There are less particles generated since there are no large dust-generating source such as a cam and a pin at a wafer array pitch conversion mechanism 15 and the mechanism part 15 is located at the lower part of the carriers 11 and 12. Thus, particles generated from the mechanism part 15 are not adhered to the wafer 1 and the carrier 11, it is valid for preventing dust.</p> |
