发明名称 ELECTRICALLY CONDUCTIVE COMPOUND FOR HEAT-RESISTANT IC PALLET
摘要 PURPOSE:To obtain a compound with high heat resistance without warping pallets and causing flow marks by modifying polypropylene resin having a specific chemical structure, kneading the resultant resin with mica, etc., and then adding a free radical former thereto. CONSTITUTION:A compound obtained by adding 0.01-0.1 pt.wt. free radial former to 100 pts.wt. composition prepared by melt kneading 67-35wt.% modified polypropylene obtained by modifying propylene.ethylene block copolymer, prepared by polymerizing ethylene with propylene in an amount of 30-5wt.% based on the total amount of polymerization in one or more stages and having 3-12wt.% ethylene content and the polymer in the first stage in an amount of 70-95wt.% based on the total weight in which the relation between the MFR of propylene homopolymer and the absorbance ratio of the infrared absorption spectral method expressed by IR-tau>=0.0203logMFR+0.950 with an unsaturated carboxylic acid (derivative) and ethylenically unsaturated silane compound or a highly crystalline propylene.ethylene block copolymer containing the above- mentioned modified polypropylene with 3-15wt.% carbon black and 30-50wt.% mica powder and then melt kneading the resultant blend.
申请公布号 JPH02269148(A) 申请公布日期 1990.11.02
申请号 JP19890090357 申请日期 1989.04.10
申请人 CHISSO CORP 发明人 DAIMON TAKASHI;ISHIBASHI TADAO
分类号 C08K3/00;C08L53/00 主分类号 C08K3/00
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