| 摘要 |
PURPOSE:To facilitate detaching work of electronic components which are connected with solder to a substrate by a method wherein terminal electrodes of electronic components that are mounted on the printed substrate and supporting members are constructed by connecting them with solder. CONSTITUTION:When an electronic component 5 as one of chip parts is connected to a pair of wiring patterns 2 and 3 which are formed on a printed substrate 1 consisting of a ceramic substance, connection is performed through a pair of supporting members 7 (electronic component brackets). The supporting members 7 become favorably used to solder and are low in heat capacity as well as heat transfer coefficient; besides, are obtained by processing a metallic thin film and the like which are equipped with material properties having required electric conductivity in such a way that they are formed into each required shape. When mounting is completed, in this way, and defective electronic components are found or some problem occur with these electronic parts, the electronic components are detached by applying a soldering iron to each connecting piece 9 and melting solder between each electrode 6 and the connecting piece after heating them. Detaching work is thus performed easily. |
