| 摘要 |
PURPOSE:To prevent the deterioration of an image quality and to reduce a cost by a method wherein an opaque resin is loaded in an area including a partially chipped wide face of an LED array chip among a plurality of LED array chips arranged on a substrate so as to cover the partially chipped part. CONSTITUTION:With respect to an LED array chip 2 in which a side face is chipped, an opaque resin 7, such as an epoxy resin, is loaded on the side face so as to cover the chipped part. To realize this structure, firstly the LED array chips 2 and drive ICs 4 are arranged on a substrate 1, and a recording image is formed in a state in which the opaque resin 7 has not been loaded yet. If an image quality is deteriorated due to an irregular reflection at the chipped part of the LED array chip side face, the opaque resin 7, e.g. a black epoxy resin, is loaded so as to cover the side face of the LED array chip including the chipped part and, thereafter, cured. A loading method using a dispenser or the like is available. |
