| 摘要 |
PURPOSE:To detect matching marks and read out informative marks, without being influenced by chip patterns on a wafer or various films, by marking to fit for the wafer side. CONSTITUTION:Matching marks 111a, 111b are formed at two spots 90 deg. apart at the side of a wafer 110 by laser beam. Next, a mask 112 is fitted for a mirror tube 103, by referring marks 113a, 113b on the mask 112 to marks 106a, 106b on the upper edge of mirror tube 103. The wafer is combined with a chuck 102. The chuck 102 and a stage 101 are moved to match the wafer 110 so that the marks 111a, 111b are referred to the marks 109a, 109b. |
