发明名称 |
IC card |
摘要 |
An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing plate are formed integrally in a thin plate-like module which is well-fitted in the above-mentioned opening while the external contact terminals on the film substrate are exposed externally.
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申请公布号 |
US4962415(A) |
申请公布日期 |
1990.10.09 |
申请号 |
US19900477197 |
申请日期 |
1990.02.06 |
申请人 |
HITACHI MAXELL, LTD. |
发明人 |
YAMAMOTO, HIROSHI;ARAKAWA, RYUTARO;ANADA, AKIO |
分类号 |
B42D15/10;G06K19/077;H01L23/538 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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