| 摘要 |
PURPOSE:To prevent the deterioration of the performance and shortening of the lifetime of a semiconductor chip due to heating at the time of mounting by increasing the bonding power of a stage, on which the semiconductor chip is loaded, and a resin sheathing sealing the chip and stage. CONSTITUTION:Through-holes 13 are filled with one parts of a resin sheathing 4 and one parts of the resin sheathing are formed, and the expansion of the resin sheathing 4 peeling the resin sheathing 4 and a stage 12 is inhibited by engaging force with a resin filled into the through-hole 13 and the through-hole 13. That is, the stage 12 and the resin sheathing 4 are bonded by the adhesion of a surface and a surface and engaging force stronger than the adhesion of the engaging of one parts of the sheathing resin 4 with the through-holes 13. Consequently, even when moisture intruding into the resin sheathing 4 intends to expand, the deformation of sheathing is inhibited by bonding power utilizing engaging force. Accordingly, no crack is generated, the reliability of a device is improved and the service life thereof can be lengthened.
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