发明名称 SUPATSUTARINGUSOCHI
摘要 PURPOSE:To improve the forming speed of a thin film and the uniformity of the film thickness by forming target electrodes of annular permanent magnets and magnet assembles which are provided in said annular magnets and are reversed with the polarities of the permanent magnets. CONSTITUTION:A sputtering device consists of a vacuum vessel 41, target electrodes 42, 43, 44, a substrate electrode 411 and high-frequency power sources 48, 49, 410, 414. Said electrodes 42, 43, 44 have plural pieces of magnet assemblies. For example, an annular permanent magnet 22 is disposed to each assembly in such a way that the surface 23 is of an N pole and a permanent magnet 24 is disposed in the central part thereof in such a way that said magnet has the S- pole surface 24 reverse from the above-mentioned magnet 24. The directions of the magnetic lines of forces are made opposite from each other with the electrodes 42, 43 and electrodes 43, 44 which are in proximity to each other.
申请公布号 JPH0243824(B2) 申请公布日期 1990.10.01
申请号 JP19850032652 申请日期 1985.02.22
申请人 HITACHI LTD 发明人 TSUNEKAWA SUKEYOSHI;PPONMA YOSHIO;MORIZAKI HIROSHI;HARADA YUKYOSHI
分类号 C23C14/36;C23C14/35;H01J37/34 主分类号 C23C14/36
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