Method and apparatus for dispensing quantities of solder

摘要

Printed circuit boards, which have hitherto been connected by putting in contact pins, have recently been electrically bonded via head wires (2) which are soldered to connection pads of the circuit board. To prepare the head wires (2) for soldering, according to the invention very accurate dispensing of solder is carried out, and this solder is put onto or impressed onto the head wire (2) as a solder preform (1) and is melted by means of a heating device (8). Certain shaped portions (9) on the head wire (2) provide for effective retention of the solder preforms (1) and mechanically high strength of the soldered joint on the circuit board. <IMAGE>