| 摘要 |
PURPOSE:To obtain a vacuum chuck device capable of easily realizing the accuracy of desired thickness at the time of grinding working by forming a bump relief coinciding with the pattern of the bump of a semiconductor wafer to the surface of a suction plate to which a suction surface is shaped. CONSTITUTION:Bump reliefs 5 coinciding with the patterns of bumps 2 formed to a semiconductor wafer 1 and having depth deeper than the height of the bumps 2 are shaped to the surface of a suction plate 14 composed of a metallic plate. A film 3 in thickness of approximately 50-60mum is stuck uniformly onto a plane consisting of the surface of the suction plate 14 and the top face of a retaining ring 7 in order to relax a shock to the wafer 1 at the time of grinding working and protect an element shaped onto the wafer 1. When a vacuum pump 10 is started, air in spaces formed by the wafer 1 and the reliefs 5 is sucked into a sealed space from suction holes 6, and the wafer 1 is sucked and held firmly under the state in which the whole surface on the bump side except the bumps 2 is abutted against the surface of the film. Accordingly, the accuracy of the thickness of the wafer 1 in grinding working can be improved.
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