METHOD FOR PRODUCTION OF CERAMIC CIRCUIT BOARD

摘要

METHOD FOR PRODUCTION OF CERAMIC CIRCUIT BOARD A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition. The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.