| 摘要 |
PURPOSE:To prevent a fine wire from being shortcircuited to a ground potential even if the fine wire is brought into contact with a shielding foil by a method wherein a sheet formed of a conductive foil whose sides both are coated with an insulating film is used as the shielding foil. CONSTITUTION:A module is composed of a ceramic board 41 mounted with a semiconductor chip 1 and provided with an insulating spacer 61 at its periphery and a ceramic board 42 mounted with a semiconductor chip 2 and provided with an insulating spacer 62 at its periphery, where the ceramic boards 41 and 42 are opposed to each other and the spacers 61 and 62 are bonded together. A shielding foil 5 has such a structure that an insulating film 51, a conductive film 52, and an insulating film 53 are pasted together, and the insulating films 51 and 53 are separated at the periphery of the foil 5 and the conductive film 52 is bonded to a wiring 12 of a ground potential formed on the substrate 41 through a conductive bonding agent 8. By this setup, a sheet formed of a conductive foil whose sides both are coated with an insulating film is used as a shielding foil whereby a fine wire is prevented from being shortcircuited to a ground potential even if the fine wire comes into contact with the shielding foil. Therefore, a module can be lessened in thickness and densely mounted with. |
